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Intel to take more risks and change to be ‘the new normal’
21 Dec.
Intel announces first FPGA with integrated HBM2
19 Dec.
Windows 10 PCs powered by Snapdragon 845 due in H2 2018
14 Dec.
Intel Pentium Silver CPUs introduced
12 Dec.
Rambus outlines HBM3 and DDR5 specs in investor meeting
8 Dec.
Intel to use Cobalt for interconnect layers at 10nm
8 Dec.
Qualcomm Snapdragon 845 to ship in devices from early 2018
7 Dec.
Samsung begins mass production of 512GB eUFS storage
5 Dec.
AMD engineer signals upcoming GPUs with GDDR6 tech
4 Dec.
Intel roadmap shows when to expect Coffee Lake-S (300 Series)
4 Dec.
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