Complete VIA Technologies coverage from HEXUS
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VIA Showcases Small and Beautiful x86 Embedded Systems in Tokyo
13 May 2008, 15:01
Experience the very latest in miniaturized, ultra power-efficient embedded platforms with VIA at ESEC Embedded Systems Expo 2008.
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VIA Joins Effort to form New Multi-Service Business Gateway Alliance at Interop
29 April 2008, 16:26
VIA compact boards to provide the x86 backbone of converged business access appliances in this industry-wide open system initiative.
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VIA Launches Open Source Driver Development Portal
29 April 2008, 16:15
VIA Linux Portal to offer drivers, technical documentation and source code for popular Linux distributions such as Ubuntu.
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VIA ARTiGO Pico-ITX Kit Highlighted at ESC Silicon Valley Keynote, BYOES Track and Microsoft SPARK Your Imagination Program
16 April 2008, 17:09
VIA ARTiGO featured in Microsoft Industry Address, embedded developer course, and is selected as one of the hardware platforms for the Microsoft SPARK Your Imagination program.
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VIA Announces Strategic Open Source Driver Development Initiative
9 April 2008, 17:06
VIA to provide vehicle for improved collaboration with Open Source community with opening of official VIA Linux Website.
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VIA C7-M ULV Processor Powers New HP 2133 Mini-Note PC
9 April 2008, 16:57
VIA enables the HP Mini to deliver performance and portability to the fast growing student market.
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Small Form Factor SIG Adopts VIA’s Pico-ITX Specification
4 April 2008, 10:30
VIA transfers Pico-ITX™ to the SIG to standardize it as an embedded platform for ultra mobility silicon and broaden the market.
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VIA announces its VX800 Series of digital media IGP chipsets
2 April 2008, 11:08
VIA's all-in-one IGP chipsets offer video, graphics and connectivity performance in a single chip measuring a minuscule 33x33mm.
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VIA and Everex to Demonstrate New CloudBook™ Max with Built-In WiMAX™ Capability for Sprint XOHM™ Network at CTIA
2 April 2008, 10:18
Stylish, full-featured mini-note delivers seamless mobile internet experience.
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New VIA VX800 Series Chipsets to Extend VIA Leadership in Ultra Mobile Market
2 April 2008, 10:14
All-in-one IGP chipsets bring unparalleled performance, high definition video and audio, and extensive power management in smallest silicon footprint ever, enabling even greater miniaturization of x86 systems.