2 January 2015, 11:00
A faster alternative to the current TSMC 28nm process.
2 December 2014, 16:00
Could enable 14nm FinFET to hit the market on time.
20 October 2014, 15:05
GloFo gets the cash over the next three years. IBM focuses upon software and research.
10 July 2014, 10:07
It is specifically looking for new materials with the potential to replace silicon.
11 July 2013, 09:45
Both TSMC and GlobalFoundries have revealed plans to move to a 20nm process.
2 April 2013, 18:09
GLOBALFOUNDRIES Demonstrates 3D TSV Capabilities on 20nm Technology.
9 January 2013, 11:51
GLOBALFOUNDRIES to Build R&D Facility in New York to Accelerate Advanced Manufacturing Technologies for Global Customers.
10 December 2012, 17:30
Heavy penalty incurred to better align with “today’s PC market dynamics”. (the PC sales slump)
21 September 2012, 11:43
Plans to catch-up to Intel in 2014 with hybrid approach combining 14 and 20nm.
13 August 2012, 19:16
ARM and GLOBALFOUNDRIES Collaborate to Enable Next-Generation Devices on 20nm and FinFET Process Technologies.