HEXUS logo
TECH GAMING BUSINESS CE MOBILE FORUMS
ALL
NEWS
REVIEWS
FEATURES
TECH EXPLAINED
PRESS RELEASES
grid view GRID
list view LIST
time view TIME
ALL CHASSIS COOLING CPU GRAPHICS LAPTOP MAINBOARD MONITORS NETWORK PSU RAM STORAGE SYSTEMS +
INDUSTRY PERIPHERALS SOFTWARE

  • Google rolls out TPU 3.0, with up to 100 petaflops per pod

    Google rolls out TPU 3.0, with up to 100 petaflops per pod 9 May

  • German IT distributor shares AMD and Intel 2018 CPU roadmaps

    German IT distributor shares AMD and Intel 2018 CPU roadmaps 4 May

  • AMD ships patches to address flaws unearthed by CTS Labs

    AMD ships patches to address flaws unearthed by CTS Labs 3 May

  • Intel Q1 2018: breaks revenue records off data centric growth

    Intel Q1 2018: breaks revenue records off data centric growth 27 April

  • AMD Zen CPU architect Jim Keller becomes an SVP at Intel

    AMD Zen CPU architect Jim Keller becomes an SVP at Intel 26 April

  • Nintendo Switch has unstoppable exploit thanks to Nvidia chip

    Nintendo Switch has unstoppable exploit thanks to Nvidia chip 25 April

  • OC expert der8auer delids an AMD Ryzen 5 2600 CPU

    OC expert der8auer delids an AMD Ryzen 5 2600 CPU 24 April

  • Intel Crimson Canyon NUC spotted in benchmarks, photos

    Intel Crimson Canyon NUC spotted in benchmarks, photos 23 April

  • AMD adds energy-efficient Ryzen 3 2200GE, Ryzen 5 2400GE APUs

    AMD adds energy-efficient Ryzen 3 2200GE, Ryzen 5 2400GE APUs 23 April

  • Intel boasts of an FPGA chip capable of 10 TFLOPS

    Intel boasts of an FPGA chip capable of 10 TFLOPS 19 April

< MORE CONTENT
Login | Register
A A A
Full HEXUS Site

About Us - Contact Us - Advertise - T&Cs

Copyright © 1998 - 2025, HEXUS.net. All rights reserved. HEXUS® is a registered trademark of HEXUS.