
10 June 2021, 12:11
It says that after fab acquisition GF broke its contract to develop the next generation of chips.

6 May 2021, 13:31
Touts 75 per cent reduced power consumption compared to iso-perf 7nm chips.

24 March 2021, 10:11
It will use Foveros packaging tech and become a volume product in 2023.

3 March 2021, 13:11
The RAD750 SBC is a radiation / temperature hardened device using a PowerPC 750 CPU.
12 November 2020, 14:54
IBM and AMD to Collaborate on AI, HPC, Confidential Computing.


17 August 2020, 10:11
It is 3x more efficient than the Power9. First Power10 systems expected H2 2021.

9 April 2020, 13:11
Mech keyboard inspired by the ThinkPad X61 has a USB connection, with Bluetooth option.

7 April 2020, 10:11
Meanwhile, Microsoft has hired Apple's former wireless tech chief for HoloLens projects.

10 March 2020, 13:11
No.1 supercomputer puts 9,216 IBM Power9 CPUs and 27,000 Nvidia V100 GPUs to the task.

27 December 2019, 12:11
Battery uses materials extracted from seawater and requires no heavy metals.