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  • IBM takes the wraps off its 7nm Power10 processor

    IBM takes the wraps off its 7nm Power10 processor 17 Aug.

  • Intel takes wraps off its 10nm SuperFin technology

    Intel takes wraps off its 10nm SuperFin technology 13 Aug.

  • Samsung X-Cube 3D IC packaging technology now available

    Samsung X-Cube 3D IC packaging technology now available 13 Aug.

  • HP lets slip a Tiger Lake-powered Pavilion 13 laptop (13-bb0027nr)

    HP lets slip a Tiger Lake-powered Pavilion 13 laptop (13-bb0027nr) 13 Aug.

  • AMD Ryzen 5000 APUs (Cezanne) spotted in benchmarks

    AMD Ryzen 5000 APUs (Cezanne) spotted in benchmarks 12 Aug.

  • Nuvia 'clean-sheet CPU design' performance previewed

    Nuvia 'clean-sheet CPU design' performance previewed 11 Aug.

  • AMD patent suggests it is looking closely at hybrid CPU designs

    AMD patent suggests it is looking closely at hybrid CPU designs 10 Aug.

  • 20GB of internal Intel documents leaked to Mega file sharing site

    20GB of internal Intel documents leaked to Mega file sharing site 7 Aug.

  • AMD Ryzen 9 4950X claimed to be a 4.8GHz boost 16C/32T CPU

    AMD Ryzen 9 4950X claimed to be a 4.8GHz boost 16C/32T CPU 6 Aug.

  • Intel Tiger Lake presentation is scheduled for 13th August

    Intel Tiger Lake presentation is scheduled for 13th August 6 Aug.

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