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  • Intel reveals three new chip packaging technologies

    Intel reveals three new chip packaging technologies 10 July

  • HEXUS Week In Review: GeForce RTX Super breaks cover

    HEXUS Week In Review: GeForce RTX Super breaks cover 5 July

  • HP, Dell, Asus, and Acer plan to shift production from China

    HP, Dell, Asus, and Acer plan to shift production from China 4 July

  • Samsung will produce next-gen Nvidia GPUs on 7nm EUV process

    Samsung will produce next-gen Nvidia GPUs on 7nm EUV process 3 July

  • Moore's Law is not dead insists Intel's Jim Keller

    Moore's Law is not dead insists Intel's Jim Keller 1 July

  • HEXUS Week In Review: 3XS Vengeance Hydro X & Nightsword RBG

    HEXUS Week In Review: 3XS Vengeance Hydro X & Nightsword RBG 28 June

  • HEXUS Week In Review: FireCuda 510 SSD and EliteDisplay E243d

    HEXUS Week In Review: FireCuda 510 SSD and EliteDisplay E243d 21 June

  • Universal Memory device touted as DRAM/SSD replacement

    Universal Memory device touted as DRAM/SSD replacement 21 June

  • PCI-SIG outlines PCI Express 6.0 Spec with 64GT/s raw bit rate

    PCI-SIG outlines PCI Express 6.0 Spec with 64GT/s raw bit rate 19 June

  • Samsung to shoulder some 14nm production strain for Intel

    Samsung to shoulder some 14nm production strain for Intel 18 June

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