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  • TSMC N3 (3nm) mass production scheduled for H2 2022

    TSMC N3 (3nm) mass production scheduled for H2 2022 25 Aug.

  • HEXUS Week In Review: Lenovo's Legion 7i laptop impresses

    HEXUS Week In Review: Lenovo's Legion 7i laptop impresses 21 Aug.

  • TSMC has produced >1 quintillion 7nm transistors since April 2018

    TSMC has produced >1 quintillion 7nm transistors since April 2018 21 Aug.

  • Cerebras teases 850k core 2nd-generation wafer scale engine

    Cerebras teases 850k core 2nd-generation wafer scale engine 19 Aug.

  • HEXUS Week In Review: Deepcool CL500 and Philips 558M1RY

    HEXUS Week In Review: Deepcool CL500 and Philips 558M1RY 14 Aug.

  • Intel 2nd gen Optane SSDs offer "multiple millions" of IOPS

    Intel 2nd gen Optane SSDs offer "multiple millions" of IOPS 14 Aug.

  • Samsung X-Cube 3D IC packaging technology now available

    Samsung X-Cube 3D IC packaging technology now available 13 Aug.

  • HEXUS Week In Review: RTX Studio workstations examined

    HEXUS Week In Review: RTX Studio workstations examined 7 Aug.

  • 20GB of internal Intel documents leaked to Mega file sharing site

    20GB of internal Intel documents leaked to Mega file sharing site 7 Aug.

  • Softbank reportedly asked TSMC and Qualcomm to bid for Arm

    Softbank reportedly asked TSMC and Qualcomm to bid for Arm 6 Aug.

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