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  • Samsung Flashbolt 3rd gen HBM2E nears volume production

    Samsung Flashbolt 3rd gen HBM2E nears volume production 4 Feb.

  • Zhaoxin x86 CPUs on its way to DIY enthusiast channels

    Zhaoxin x86 CPUs on its way to DIY enthusiast channels 30 Jan.

  • Coronavirus impact on PC and tech manufacturing weighed

    Coronavirus impact on PC and tech manufacturing weighed 29 Jan.

  • AMD reports record annual revenue of $6.73bn in 2019

    AMD reports record annual revenue of $6.73bn in 2019 29 Jan.

  • Lancaster Uni forges ahead with UK III-V Memory developments

    Lancaster Uni forges ahead with UK III-V Memory developments 14 Jan.

  • Leading tech analyst says "PC innovation is skyrocketing"

    Leading tech analyst says "PC innovation is skyrocketing" 13 Jan.

  • AMD to usurp Apple as TSMC's largest 7nm customer

    AMD to usurp Apple as TSMC's largest 7nm customer 3 Jan.

  • Chip-to-chip quantum teleportation demonstrated

    Chip-to-chip quantum teleportation demonstrated 30 Dec.

  • Festive greeting from Team HEXUS

    Festive greeting from Team HEXUS 25 Dec.

  • Kioxia Twin BiCS Flash shows way beyond QLC densities

    Kioxia Twin BiCS Flash shows way beyond QLC densities 18 Dec.

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