PRESS RELEASE
Taipei, Taiwan - May 31, 2016-TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC Computing Technology Corporation, exhibits its broad lines of storage, cloud computing and HPC solutions optimized for data center, virtualization, supercomputing, cloud and enterprise environments this week at Computex 2016 in Taipei, Taiwan. Highlights of TYAN’s new developments in system architecture and power efficiency include the GT62B-B5539 1U Intel® Xeon® processor D-1500 based storage server and the FT76-B7922 4U 4-socket Intel® Xeon® processor E7-8800/4800 v3/v4 based server with support up to 4x Intel® Xeon Phi™ coprocessor modules. TYAN’s latest dual-socket Intel® Xeon® processor E5-2600 v4-based platforms and NVMe optimized server platforms will also be on display.
“Nowadays, operators of enterprises, data centers and cloud server providers seek for solutions with highest performance, the lowest power consumption and the best price-performance ratio for their infrastructure deployment. TYAN’s Intel Xeon based solutions can meet the future trend of cloud computing to deliver high performance, low power consumption with a high price-performance ratio to address a wide range of diffident applications,” said Albert Mu, Vice President of MiTAC Computing Technology Corporation's TYAN Business Unit.
Intel® Xeon® Processor D-1500 Based-Platform to Bring Efficiency and Intelligence to the Storage Market
For the high-efficient, intelligent storage market, TYAN GT62B-B5539 system platform features the new Intel Xeon processor D-1500, a low-power SoC (System-on-Chip) architecture. It is designed to deliver the best performance-per-watt for the storage market. The 1U GT62B-B5539 platform supports Intel Xeon processor D-1500 series CPU with up to 16 cores, 4x DDR4 DIMM slots, 2x 10GbE (Intel® X557) and 2x GbE LOM, 1x FH/HL PCI-E x8 slot, 2x mezzanine slots for various options and 10x hot-swap 2.5” storage devices, which include the support up to 4x NVMe devices.
4-socket FT76-B7922 Maximizes the Performance of In-memory Computing for HPC
TYAN FT76-B7922 is the first multi-purpose server platform that simultaneously supports scale-up (fat node) and scale-out (many-core coprocessor node) application scenarios. The platform accommodates 4x Intel Xeon processor E7-8800/4800 v4 CPUs and 4x Intel Xeon Phi 7120P (5110P/3120P) cards or four GPGPUs within the enclosure for typical HPC applications. With 1:1 CPU-to-GPU, or CPU-to-Coprocessor ratio, TYAN FT76-B7922 provides a high price-performance and performance-per-watt for HPC community that both needs CPU- and GPU-intensive computing workloads. The quad-socket Intel® Xeon® E7-8800/4800 v3/v4 platform is able to offer customers a maximum memory pool that reaches 6TB of RAM when 96x 64GB DDR4 DIMMs are deployed.
Intel® Xeon® processor E5-2600 v4-based Platform to Deliver Energy Efficient Performance for Datacenters
TYAN also exhibits the latest Intel Xeon processor E5-2600 v4-based servers and motherboards. The dual-socket S7082 motherboard is capable of offering up to 44 cores and 88 threads per motherboard along with 1.5TB of DDR4-2400 memory speed by populating 64GB DIMMs on all slots. The TYAN Xeon E5 platform-based server systems and motherboards enable enterprise and datacenter customers to benefit from the latest advances in cloud computing, HPC, and storage applications.
TYAN NVMe Optimized Server Platforms Improve Performance and Storage Efficiency
In order to address critical data in need of higher performance for storage, TYAN takes full advantage of Intel® NVMe (Non-volatile memory express) technology, faster IOPS (input/output operations per second) and 6 times performance of a SATA SSD, to highlight the hybrid SSDs storage offerings of GT62B-B5539, GT62B-B7076, GN70-B7086, and TN70B-B7086 storage platforms featuring the support for up to 4x NVMe drives at COMPUTEX.
TYAN Product Exhibits @ Computex 2016
HPC& Coprocessor applications
FT76-B7922: 4U quad-socket Intel Xeon processor E7-8800/4800 v3/v4-based platform with support for up to 4 Intel® Xeon Phi™ coprocessor modules, 96x DDR4 DIMM slots, and up to 8x SFF, hot-swap SAS 12Gb/s devices
FT77C-B7079: 4U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform with support for up to 8 Intel Xeon Phi coprocessor modules, 24x DDR4 DIMM slots, and up to 10x LFF/SFF, hot-swap SATA 6Gb/s devices
FT48A-B7070: 4U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 8x LFF/SFF and 8x SFF, hot-swap SAS/SATA 6Gb/s devices
GN70-B7086: 2U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 8x LFF/SFF, hot-swap SAS 12Gb/s devices, 4 of the bays can support NVMe devices in premium configuration.
Storage applications:
TN70J-E3250: 2U, SAS 12GB JBOD platform supports up to 12x LFF/SFF, hot-swap SAS 12Gb/s devices
GT56-B7086: 1U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 10x SFF, hot-swap SAS/SATA 6Gb/s devices
TN70B-B7086: 2U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 12x LFF/SFF, hot-swap SAS 12Gb/s devices, 4 of the bays can support NVMe devices in premium configuration.
GT62B-B5539: 1U single-socket Intel Xeon processor D-1500 (SoC) based platform supports up to 10x SFF, hot-swap SAS 12Gb/s devices, 4 of the bays can support NVMe devices in premium configuration.
Cloud applications:
GT24B-B5542: 1U single-socket Intel Xeon processor E3-1200 v5-based platform supports up 4x LFF/SFF hot-swap SAS 12Gb/s devices
GT62B-B7076: 1U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 10x SFF, hot-swap SAS 12Gb/s devices, 4 of the bays can support NVMe devices in premium configuration.
GT86A-B7083: 1U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 12x LFF/SFF and 1x SFF internal devices
GT24B-B7076: 1U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 4x LFF/SFF hot-swap SAS 12Gb/s devices
Server/Workstation Motherboards:
S7082: Dual-socket Intel Xeon processor E5-2600 v3/v4-based server board in EEB (12” x 13”) form factor for 2U or pedestal VM server deployment
S5539: 1U single-socket Intel Xeon processor D-1500-based server board in micro ATX (9.6" x 9.6") form factor for 1U or pedestal low-power storage server deployment
S7076: Dual-socket Intel Xeon processor E5-2600 v3/v4-based server board in rack-optimized, EATX (12” x 13”) form factor for 1U intermediate server deployment
S7086: Dual-socket Intel Xeon processor E5-2600 v3/v4-based server board in rack-optimized, EATX (12” x 13”) form factor for 2U full-featured server deployment
S5620: Single-socket Intel Xeon processor E5-2600/1600 v3/v4-based server board in ATX (12” x 9.6”) form factor for compact server deployment
S5542: Single-socket Intel Xeon processor E3-1200 v5-based server board in ATX (12" x 9.6") form factor for entry server deployment
S5545: Single-socket Intel® 6th Generation Core™ i3/i5/i7 series processor based board in micro ATX (9.6" x 9.6") form factor for embedded applications
S5547: Single-socket Intel 6th Generation Core i3/i5/i7 series processor based board in flex ATX (9" x 7.5") form factor for embedded applications
About TYAN
TYAN, a leading server brand of MiTAC Computing Technology Corporation under the MiTAC Holdings Corporation (TSE:3706), designs, manufactures and markets advanced x86 and x86-64 server/workstation board and system products. The products are sold to OEMs, VARs, System Integrators and Resellers worldwide for a wide range of applications. TYAN enable customers to be technology leaders by providing scalable, highly-integrated and reliable products such as appliances for cloud service providers (CSP) and high-performance computing and server/workstation used in CAD, DCC, E&P and HPC markets.
For more information, visit MiTAC Holdings Corporation’s website at http://www.mic-holdings.com or TYAN’s website at http://www.tyan.com
