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  • SiS Announces New Technology – HyperStreaming Architecture 27 Sept.

  • SiS Chipset Delivers Performance for the AMD(r) Platform SiS748, Exclusive Support of FSB 400/DDR400 27 Sept.

  • SiS Chipset Delivers Performance for the AMD® Platform 27 Sept.

  • INTEL LAUNCHES INTEL® CENTRINO™ MOBILE TECHNOLOGY 27 Sept.

  • VIA Launches KN400 Chipset to Support Mobile AMD Athlon™ XP-M Processors 27 Sept.

  • AMD BREAKS INTO THIN-AND-LIGHT MARKET WITH NEW PROCESSORS POWERING FUJITSU NOTEBOOK 27 Sept.

  • AMD JUMP-STARTS COMPETITION IN THIN-AND-LIGHT NOTEBOOK MARKET; UNVEILS 12 NEW MOBILE PROCESSORS 27 Sept.

  • OCZ unveils high speed QBM (Quad Band Memory) solutions 27 Sept.

  • AMD CHAIRMAN JERRY SANDERS DISCUSSES ACCELERATING RECOVERY OF SEMICONDUCTOR INDUSTRY 27 Sept.

  • SOYO Poised to Enter the Wireless Networking Market With the Launch of Aerielink 27 Sept.

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