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  • Samsung to start HBM mass production early next year

    Samsung to start HBM mass production early next year 21 Aug.

  • AMD discrete GPU market share eroded to less than 20 per cent

    AMD discrete GPU market share eroded to less than 20 per cent 19 Aug.

  • Intel Optane products to utilise revolutionary 3D XPoint memory

    Intel Optane products to utilise revolutionary 3D XPoint memory 18 Aug.

  • TSMC starts volume production of 16nm chips

    TSMC starts volume production of 16nm chips 14 Aug.

  • Samsung begins mass production of 256-Gigabit, 3D V-NAND Flash

    Samsung begins mass production of 256-Gigabit, 3D V-NAND Flash 12 Aug.

  • G.SKILL DDR4 memory breaks world records at 4795.8MHz

    G.SKILL DDR4 memory breaks world records at 4795.8MHz 6 Aug.

  • Toshiba, SanDisk unveil world's first 256Gb, 48-Layer BiCS NAND

    Toshiba, SanDisk unveil world's first 256Gb, 48-Layer BiCS NAND 4 Aug.

  • Intel 3D XPoint NV memory is up to 1,000 times faster than NAND

    Intel 3D XPoint NV memory is up to 1,000 times faster than NAND 29 July

  • Nvidia starts to bundle Metal Gear Solid V: The Phantom Pain

    Nvidia starts to bundle Metal Gear Solid V: The Phantom Pain 24 July

  • Qualcomm to slash workforce following chip demand slump

    Qualcomm to slash workforce following chip demand slump 24 July

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