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  • Samsung readying 24Gb DDR5 ICs - 768GB DIMMs on the way

    Samsung readying 24Gb DDR5 ICs - 768GB DIMMs on the way 2 Aug.

  • JEDEC publishes LPDDR5 and LPDDR5X standards

    JEDEC publishes LPDDR5 and LPDDR5X standards 29 July

  • TSMC's 2nm fab building plans have been approved

    TSMC's 2nm fab building plans have been approved 29 July

  • AMD revenue grows 99 per cent YoY driven by strong demand

    AMD revenue grows 99 per cent YoY driven by strong demand 28 July

  • Intel announces node renaming and roadmap to the Angstrom era

    Intel announces node renaming and roadmap to the Angstrom era 26 July

  • Nvidia Lovelace GPUs booked in as TSMC 5nm parts

    Nvidia Lovelace GPUs booked in as TSMC 5nm parts 26 July

  • First benchmarks of China's Loongson 3A5000 CPU surface

    First benchmarks of China's Loongson 3A5000 CPU surface 26 July

  • Intel NUC 11 Extreme 'Beast Canyon' now up for pre-order

    Intel NUC 11 Extreme 'Beast Canyon' now up for pre-order 23 July

  • Intel in talks to buy GlobalFoundries, says WSJ report

    Intel in talks to buy GlobalFoundries, says WSJ report 16 July

  • JPR forecasts dramatic growth in PC hardware inventory and sales

    JPR forecasts dramatic growth in PC hardware inventory and sales 14 July

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