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  • Samsung introduces industry first 108MP image sensor for phones

    Samsung introduces industry first 108MP image sensor for phones 12 Aug.

  • GloFo tapes out Arm-based 3D high-density test chip

    GloFo tapes out Arm-based 3D high-density test chip 9 Aug.

  • Samsung Galaxy Book S packs a Snapdragon 8cx processor

    Samsung Galaxy Book S packs a Snapdragon 8cx processor 8 Aug.

  • Samsung announces 6th generation V-NAND SSDs

    Samsung announces 6th generation V-NAND SSDs 6 Aug.

  • TSMC quietly upgrades 7nm and 5nm processes for performance

    TSMC quietly upgrades 7nm and 5nm processes for performance 1 Aug.

  • MediaTek unveils its Helio G90 Series smartphone gaming chips

    MediaTek unveils its Helio G90 Series smartphone gaming chips 30 July

  • AMD enjoys processor sales share surge in Japan

    AMD enjoys processor sales share surge in Japan 29 July

  • AMD says Steam Hardware Survey miscounts processor data

    AMD says Steam Hardware Survey miscounts processor data 26 July

  • Apple confirms Intel smartphone modem business buyout

    Apple confirms Intel smartphone modem business buyout 26 July

  • TSMC confirms its 3nm node development is "going well"

    TSMC confirms its 3nm node development is "going well" 24 July

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