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  • TSMC and GlobalFoundries resolve legal disputes

    TSMC and GlobalFoundries resolve legal disputes 29 Oct.

  • TSMC begins construction of next-gen 3nm fab

    TSMC begins construction of next-gen 3nm fab 28 Oct.

  • Intel CEO: DG1 Xe graphics card successfully powered on

    Intel CEO: DG1 Xe graphics card successfully powered on 25 Oct.

  • Samsung announces Exynos 990 premium mobile processor

    Samsung announces Exynos 990 premium mobile processor 24 Oct.

  • Upcoming Intel Ghost Canyon NUCs are 'The Element' in a box

    Upcoming Intel Ghost Canyon NUCs are 'The Element' in a box 23 Oct.

  • TSMC market value casts a shadow over Intel

    TSMC market value casts a shadow over Intel 21 Oct.

  • AMD product guide mentions as yet unannounced Ryzen 7 3750X

    AMD product guide mentions as yet unannounced Ryzen 7 3750X 17 Oct.

  • Corsair announces its Vengeance LPX DDR4-5000 RAM kit

    Corsair announces its Vengeance LPX DDR4-5000 RAM kit 11 Oct.

  • Intel announces end of life plan for most Kaby Lake CPUs

    Intel announces end of life plan for most Kaby Lake CPUs 11 Oct.

  • Sony confirms PlayStation 5 for winter 2020

    Sony confirms PlayStation 5 for winter 2020 9 Oct.

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