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GENERAL BUSINESS SYSTEM BUILDERS TELCOS

  • VIA Announces VIA AMOS-5000 Chassis Kit for Fanless Em-ITX Embedded Systems 4 Nov.

  • WD ENTERS TRADITIONAL ENTERPRISE HDD MARKET WITH FIRST SAS PRODUCT 3 Nov.

  • Oak Ridge National Laboratory Looks to NVIDIA “Fermi” Architecture For New Supercomputer 1 Oct.

  • TYAN Announced New Array of Product Lines that Fully Supports Networking and Storage as Being the Real Server Ingredient Provider 30 Sept.

  • A-DATA Released High-density DDR3 1333 8GB Memory for Servers 28 Sept.

  • HP Introduces SkyRoom: Powerful and Affordable Videoconferencing for Businesses 23 Sept.

  • TYAN Announces Six New AMD Server Chipset-based Platforms Supporting the Latest Six-Core AMD Opteron™ Processors 22 Sept.

  • ASUS Launches Lynnfield Platform Rackmount Servers with New Intel® Xeon® 3400 Processors 21 Sept.

  • ASUS Launches Lynnfield Platform Rackmount Servers with New Intel Xeon 3400 Processors 21 Sept.

  • Lenovo Unveils Powerful Single-Processor ThinkServers with Enhanced Management and New Virtualisation Features 9 Sept.

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