VIA Unveils New Mobile Version of the Cool Running VIA C3(tm) Processor at CeBIT Germany 2002 Provides a low power solution for the mobile market with a highly compatible ?FCPGA processor available in speeds up to 933MHz. Hannover, Germany, 14th March 2002 - VIA Technologies, Inc. a leading innovator and developer of core logic chipsets, microprocessors, and multimedia, networking and communications chips, today announced the launch of the new ?FCPGA VIA C3(tm) processor available at speeds of up to 933 MHz with enhanced power consumption and thermal dissipation properties for the mobile computer market. With a typical power consumption of 6 watts and an ultra low voltage of 1.35 volts, the new mobile VIA C3(tm) processor is the industry's lowest power notebook processor maximizing battery life without sacrificing compatibility or performance. The mobile VIA C3(tm) processor debuts at speeds of up to 933 MHz and is fully compatible with the existing standard ?FCPGA socket infrastructure to ensure easy integration and rapid time to market for OEMs and notebook, Tablet PC, Web Pad and other mobile device vendors. "The launch of the new ?FCPGA mobile VIA C3(tm) processor builds on our leadership position in the mobile core logic chipset and graphics markets," commented Paul Hsu, Special Assistant to the President, VIA Technologies, Inc. "It enables us to provide our customers with the industry's richest platform of low power, high performance solutions for a complete range of full featured, slim and light, and mini-note notebooks covering all market segments." ?FCPGA Mobile VIA C3(tm) Processor With its leading-edge 0.13 micron manufacturing processes and boasting the world's smallest x86 processor die size, the VIA C3(tm) processor is the coolest running processor on the market today and delivers ultra low power consumption and world class levels of stability. Other features include 128KB Level 1 and 64KB Level 2 full speed cache, as well as support for a 100/133MHz Front Side Bus and MMX(tm) and 3DNow! multimedia instructions, to ensure robust levels of performance for all the most popular mainstream software and Internet applications. The ?FCPGA mobile VIA C3(tm) processor will ship at speeds up to 933MHz; pricing information is available on request. Future versions will also come with VIA LongHaul(tm) power management technology, which can reduce the processor's voltage and clock speed to maximize battery life. About VIA Technologies, Inc. VIA Technologies, Inc. is a leading innovator and developer of PC core logic chipsets, microprocessors, and multimedia, communication and networking chips. VIA delivers value to the PC industry by designing, marketing, and selling high-performance VIA Apollo core logic chipsets for the full range of PC platforms, and cost-effective VIA C3(tm) processors for Value PCs and Internet Appliances, as well as developing complete solutions for the PC platform through its VPSD Business Unit. Its customers include the world's top OEMs, mainboard manufacturers, and system integrators. VIA is headquartered in Taipei, Taiwan, at the center of the Greater China high-tech manufacturing engine, and has branch offices in the US, China and Europe. The company is listed on the Taiwan Stock Exchange (TSE2388), and achieved annual revenues of nearly US$1 billion in 2001. Additional information can be found at www.via.com.tw