VIA C3™ 1GHz Processor Generates Continued Industry support for S370

Provides the right platform to meet the
growing demand for modern small and quiet systems

Taipei, Taiwan, 6 June 2002 -
VIA Technologies, Inc, a leading innovator and developer of silicon chip
technologies and PC platform solutions, today announced continued strong support
for the Socket 370 processor socket from major motherboard makers after the
release of the new VIA C3™ 1GHz processor earlier this week.

“We are confident in the
continued demand for Socket 370 systems and are committed to maintaining our
support for this highly proven and flexible platform,” related Paul Hsu, Special
Assistant to the President, VIA Technologies, Inc. “Our customers are also
experiencing a growth in demand for more unobtrusive PC systems and the Socket
370 infrastructure best suits this market segment.”

“The compelling total system
savings from VIA C3™ processor based systems is driving the demand for Socket
370 motherboards,” said Jacky Tsai, Vice President PCBA Business Unit, Giga-Byte
Technology Co., Ltd. “This demand is further enhanced as the VIA C3™ processor
crosses the 1GHz barrier.”

“Socket 370 motherboards are
still in demand due to their cost effectiveness and high level of flexibility,”
commented Joseph Hsu, President Micro-Star International Co., Ltd. “Production
of Socket 370 motherboards will continue with the launch of the new VIA C3™ 1GHz
processor.”

“Modern PCs are becoming smaller
and quieter,” noted Gerald Wang, Senior Director Motherboard Product B.D., AOpen
Inc. “The low power consumption and resulting quiet operation of Socket 370
systems, make them ideal for today’s innovative small footprint designs.”

“Socket 370 is the most mature
and flexible platform currently available,” said Amos Wu, Vice President,
Biostar® Group. “Together with the VIA C3™ processor, system builders are able
to provide office, school and home PCs at prices that were previously not
possible.”

“There is still a lot of support
for Socket 370 motherboards, especially in the home, business and education
markets,” commented Scott Thirlwell, Marketing Manager, DFI Corporation, Taiwan.
“Together with the VIA C3™ processor, system builders can build an inexpensive
yet fully functional small and quiet system.”

"The combination of the low
power VIA C3™ 1GHz processor and Socket 370 motherboards, allow system
integrators to build attractive, small and quiet systems that are fast becoming
the new trend," stated Allen Yang, President & CEO Jet Way Information Co. Ltd.
"There is still strong demand for Socket 370 motherboards and naturally we will
continue production in the foreseeable future."

VIA C3™ 1GHz Processor

Building on the VIA C3™
processor’s reputation for Cool Processing, the VIA C3™ 1GHz processor continues
to boast the world's smallest x86 processor die size and industry leading 0.13
micron manufacturing process, delivering ultra low power consumption and world
class levels of stability. Other features include 128KB Level 1 and 64KB Level 2
full speed cache, as well as support for a 100/133MHz Front Side Bus and MMX™
and 3DNow! multimedia instructions, to ensure robust levels of performance for
all the most popular mainstream software and Internet applications. The VIA C3™
1GHz processor will ship at speeds from 1GHz; pricing information is available
on request. Future versions will continue to embrace the Socket 370 form factor.

About
VIA Technologies, Inc.