PRESS RELEASE
Qualcomm and Ericsson commercialization to enable doubling of 3G uplink data speeds for smartphones and tablets as early as Q2 2014
SAN DIEGO - February 24, 2014 - Qualcomm Incorporated today announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., in cooperation with Ericsson, has successfully demonstrated Dual-Carrier High-Speed Uplink Packet Access (DC-HSUPA) for the first time on a commercial smartphone. The demo marks an important milestone in the continued evolution of 3G mobile communications technology, as DC-HSUPA can double the current maximum 3G uplink data rate, potentially resulting in higher network capacity for operators and a better user experience for customers.
Qualcomm Technologies' industry-leading Qualcomm® SnapdragonTM 801 processor and its integrated multi-mode modem technology, powered the demonstration, which is being shown this week at Mobile World Congress.
"Much of the world's population relies on 3G technology to stay connected to the people and things that matter most to them," said Serge Willenegger, vice president of product management, Qualcomm Technologies, Inc. "Qualcomm has been a leader in 3G connectivity from the earliest days, and this latest milestone in 3G evolution will allow Qualcomm® GobiTM modem technologies to continue to enable an improved user experience and better network efficiency for operators worldwide."
"DC UL-HSPA is an important step in the continuing evolution of HSPA, providing up to twice the uplink speed for applications," said Nils Viklund, Vice President, Product Line WCDMA RAN at Ericsson. "As WCDMA is the access technology for the majority of users in the world, improving the consumer experience in this technology is very important. Existing Ericsson customers benefit from this feature in software release WCDMA RAN W14B. This will enable our worldwide customer base to provide better user experience when, for instance, sharing experiences like photos or videos. The demonstration in Barcelona is a great proof of that."
DC-HSUPA enables an uplink date rate of up to 11.5Mbps - double the current 3G maximum of 5.7Mbps - making it faster and easier for users of mobile devices to do things like upload photos to their social networks or email. DC-HSUPA is expected to be commercially available in smartphones and tablets from leading manufacturers in Q2 of this year.
About Qualcomm Incorporated
Qualcomm Incorporated (NASDAQ: QCOM) is a world leader in 3G, 4G and next-generation wireless technologies. Qualcomm Incorporated includes Qualcomm's licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm's engineering, research and development functions, and substantially all of its products and services businesses, including its semiconductor business, QCT. For more than 25 years, Qualcomm ideas and inventions have driven the evolution of digital communications, linking people everywhere more closely to information, entertainment and each other. For more information, visit Qualcomm's website, OnQ blog, Twitter and Facebook pages.
