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  • USB 3.2 standard to absorb USB 3.0 and USB 3.1 specifications

    USB 3.2 standard to absorb USB 3.0 and USB 3.1 specifications 27 Feb.

  • Lenovo launches laptops, AiOs, and more at MWC

    Lenovo launches laptops, AiOs, and more at MWC 27 Feb.

  • Thermalright HR22 Plus black passive cooler spotted

    Thermalright HR22 Plus black passive cooler spotted 27 Feb.

  • Nvidia GeForce GTX 1650 packaging artwork leaked

    Nvidia GeForce GTX 1650 packaging artwork leaked 27 Feb.

  • HTC 5G Hub launched with 5-inch screen

    HTC 5G Hub launched with 5-inch screen 26 Feb.

  • Energizer launches the P18K Pop, an 18,000mAh smartphone

    Energizer launches the P18K Pop, an 18,000mAh smartphone 26 Feb.

  • Microsoft minimises differences between Xbox & Windows games

    Microsoft minimises differences between Xbox & Windows games 26 Feb.

  • Nvidia to flesh out the GeForce GTX 16 line in coming weeks

    Nvidia to flesh out the GeForce GTX 16 line in coming weeks 26 Feb.

  • MicroSD Express integrates PCIe and NVMe for up to 985MB/s

    MicroSD Express integrates PCIe and NVMe for up to 985MB/s 25 Feb.

  • Huawei Mate X foldable 5G smartphone launched

    Huawei Mate X foldable 5G smartphone launched 25 Feb.

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