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  • China economic regulator looking at memory chip price fixing

    China economic regulator looking at memory chip price fixing 29 Dec.

  • Micron looks forward to 2018 being a big year for GDDR6

    Micron looks forward to 2018 being a big year for GDDR6 22 Dec.

  • Intel to take more risks and change to be ‘the new normal’

    Intel to take more risks and change to be ‘the new normal’ 21 Dec.

  • Intel announces first FPGA with integrated HBM2

    Intel announces first FPGA with integrated HBM2 19 Dec.

  • Windows 10 PCs powered by Snapdragon 845 due in H2 2018

    Windows 10 PCs powered by Snapdragon 845 due in H2 2018 14 Dec.

  • Intel Pentium Silver CPUs introduced

    Intel Pentium Silver CPUs introduced 12 Dec.

  • Rambus outlines HBM3 and DDR5 specs in investor meeting

    Rambus outlines HBM3 and DDR5 specs in investor meeting 8 Dec.

  • Intel to use Cobalt for interconnect layers at 10nm

    Intel to use Cobalt for interconnect layers at 10nm 8 Dec.

  • Qualcomm Snapdragon 845 to ship in devices from early 2018

    Qualcomm Snapdragon 845 to ship in devices from early 2018 7 Dec.

  • Samsung begins mass production of 512GB eUFS storage

    Samsung begins mass production of 512GB eUFS storage 5 Dec.

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