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  • Intel and Apple are first in line for TSMC 3nm chips says report

    Intel and Apple are first in line for TSMC 3nm chips says report 5 July

  • Qualcomm unveils the Snapdragon 888 Plus

    Qualcomm unveils the Snapdragon 888 Plus 29 June

  • AMD quietly lists the 4700S 8-core processor desktop kit

    AMD quietly lists the 4700S 8-core processor desktop kit 28 June

  • Intel Core i9-11980HK (Tiger Lake-H)

    Review: Intel Core i9-11980HK (Tiger Lake-H) 21 June

  • Windows 11 benchmarked with Intel hybrid processors

    Windows 11 benchmarked with Intel hybrid processors 21 June

  • AMD pleased with Google Cloud Epyc 'Milan' data centre plans

    AMD pleased with Google Cloud Epyc 'Milan' data centre plans 18 June

  • Intel unveils its first IPU - Infrastructure Processing Unit

    Intel unveils its first IPU - Infrastructure Processing Unit 15 June

  • Recently published patent hints at AMD hybrid CPU plans

    Recently published patent hints at AMD hybrid CPU plans 14 June

  • AMD video focuses on its 3D stacking technology

    AMD video focuses on its 3D stacking technology 11 June

  • Intel pondering purchase of RISC-V chip designer SiFive

    Intel pondering purchase of RISC-V chip designer SiFive 11 June

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